1·The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
2·The ideal formula of the adhesive is determined by series of experiments and the reaction process and thermal stability of copper foil adhesives are studied by te, TGA and DTA.
通过一系列研究确定了胶粘剂的理想配方，并通过红外光谱、热失重和差热分析法对其铜箔胶粘剂的反应过程和热稳定性进行了探讨。
3·After the plating, corrosion resistance, heat resistance and binding strength of electrolyte copper foil were improved.
经过处理后的电解铜箔耐蚀性、耐热性和粘合强度等性能指标均有明显提高。
4·The influence of copper foil surface quality on electrical performance of power transformer is analyzed, the key technology for monitoring the surface flaw with machine vision system is studied.
分析铜箔表面质量缺陷对电力变压器电气性能的影响，研究采用机器视觉系统对铜箔表面质量缺陷监视的关键技术。
5·The copper foil board base paper is the fundamental material to product the paper of printing line board, and also is a kind of higher degree special industrial paper.
覆铜箔层压板原纸是生产印刷线路板用全纸基覆铜箔层压板的基础材料，是一种生产难度较高的特种工业用纸。